Syenta, located in Sydney, is seeking a skilled professional for substrate IC package design, focusing on advanced packaging technologies. The ideal candidate has a Bachelor's or Master's degree in Electrical Engineering and over 5 years of experience in high-performance substrate designs. Responsibilities include designing complex interposers and ensuring robust signal integrity. The position offers a hybrid work environment, competitive salary between $130,000 and $180,000, and opportunities for professional growth in a dynamic startup culture.
#J-18808-Ljbffr